Specifications | Product | LSR 609 Epoxy Structual Adhesive | |
Cure Condition | Heat Cure | ||
Recommend for | Chip Secure Potting | ||
Material Properties | Density, g/m3 | 1.45 | |
Hardness, Shore D | 94 | ||
Use Temperature Range, ℃ | 260 | ||
Viscosity mPaS at 25℃ | 142,000~150,000 | ||
Firm Gel Time, Second at 150℃ | 78~82 | ||
Firm Gel Time, Second at 200℃ | 9~12 | ||
Tensile Shear Strength, Mpa at 25℃ | 28 | ||
Tensile Shear Strength, Mpa at 150℃ | 16.5 |