This product is a room temperature curing electronic component potting compound. It is packaged in two components, A and B. Component A is a black (or white) viscous liquid and Component B is a brown-yellow liquid. It can be filled and sealed after being stirred well. The two components A and B can be stored for a long time (storage period is not less than one year). This product has the characteristics of fast curing speed, easy defoaming, low shrinkage, non-toxic and harmless. This product has good electrical properties, and at the same time has a good cured surface, suitable for potting and bonding of electronic devices.