Rigid PCB Production Capacility
Item |
Standard(mass production) |
Advanced(Sampling) |
Layers |
1-12Layer |
12-56Layer |
Final Board Thickness |
0.4-3.2mm |
0.2-7.00mm |
Max. Panel Size |
508*640mm |
610*1400mm |
Material | CEM-3, FR-4, (High CTI, Halogen Free, high frequency), Metal base. |
CEM-3, FR-4, (High CTI, Halogen Free, high frequency), Metal base. |
Material Supplier |
KB, SY, NY, ITEQ, Uniplus, TUC |
Rogers, Arlon, Taconic, Nelco... |
Surface Finish |
LF-HASL, OSP, ENIG, Immersion Silver, Immersion Tin | LF-HASL, OSP, ENIG, Immersion Silver, Immersion Tin |
Impedance Control |
±10% ohm |
±10% ohm |
Min. Line Width/Space |
3/3mil |
3/2.5mil |
Max. Aspect Ratio |
10: 1 |
30:1 |
Copper Thickness |
18um, 35um, 70um, 105um |
140um(inner layer)-280um(outer layer) |
Min. Finshed Hole Size |
0.2mm |
0.1mm |
Soler Mask |
Green, white, black, grey, blue(dark-blue, light-blue), pink, organge, Purple, red, yellow |
Green, white, black, grey, blue(dark-blue, light-blue), pink, organge, Purple, red, yellow |
Production Process