Product Information |
Product Name | Easy Clean Up Of Uncured Adhesive Pcb SMTepoxy Dispensing Adhesive | |
Item No. | 3609F | |
Typical Uncured Properties: | ||
Appearance | Red Gel | |
Viscosity (cps) Brookflied DVII+ SP14@5rpm@25 °C | 250,000 | |
Yield Value @25oC, Pa | 560 | |
Flash Point ( °C) | >100 | |
Particle Size (microns) (mean particle size, 15 microns) | <75 | |
Density (g/cm3 )
| 1.20 | |
Copper Corrosion | No | |
Shelf Life (months @ 2 °C to 8 °C) | > 6 | |
Cured Properties: | ||
Density, BS5350 g/cm3 | 1.25 | |
Coefficient of Thermal Expansion (ppm/ °C) | ||
Alpha1 | 50 | |
Alpha2 | 156 | |
Modulus DMTA @ 1kHz (GPa)
| 2.5 | |
Glass Transition Temperature, DSC (°C)) | 124 | |
Thermal Conductivity (W/moK) | 0.29 | |
Specific Heat, kJ.kg-1.K-1 | 0.32 | |
Overlap Shear Test (psi) (Taiyo PSR 4000 coated FR4) | >2,200
| |
Surface Insulation Resistance (Bellcore GR-78) |
| |
After 4 Days (ohms) | >109 | |
After 7 Days (ohms) | >109 | |
Dielectric Constant/Loss, ASTM D150 100KHz | 3.9/0.015
| |
Volume resistivity,ASTM D257, cm | 2.4x1015 | |
Surface resistivity,ASTM D257 | 2.4x1015 | |
Electromigration (Bellcore GR-78) | Passed | |
Electrolytic Corrosion,DIN 53489 | AN-1.2 | |
Hardness (Shore D) | > 84 | |
Curing Condition: | 3609F is designed to cure in 90 to 120 seconds at | |
>109 >109 Introduction | 3609F is an epoxy surface mount adhesive that cures rapidly at elevated temperatures and has been designed for use in high speed printed circuit board assembly for the attachment of surface mount components. The very low moisture absorption allows expose to humidity in open baths, without affecting dispensability or causing void formation in the cured adhesive. 3609F has been successfully used in dispense, particularly suited for high wet strength and good electrical characteristics are required. | |
Features and Benefits | 1. Excellent Dispensability at Speeds in Excess of 40k dph. 2. 3609F can be cured in 90 to 120 seconds at 150°C. 3. No Heavy Metals (Cd, Se).
| |
Typical Applications Include | Designed for use in high speed printed circuit board assembly for the attachment of surface mount components. |
Product Display |
Hot Sale |
Product Advantage |
|
|
|
|
Compared with traditional materials, the phase change thermal interface materials can cover and fill the gap and hollow between the contact interfaces when being liquid. |
Company Overview |
Certificate |
Contact |
We can make many specifications according to your request! For more information. Please contact us. | ||||||||||
|
FAQ |
1. What are your main products? We supply thermally conductive pad, thermally silicone RTV, thermally conductive silicone pug, thermally double component silicone, thermally conductive materials, phase change thermal interface materials, thermally conductive insulators and thermal grease. Samples of silicone sealant acetic acid are available, but the freights need to be paid by the buyers. 2. What about the product quality and which certificate do you have? We have UL certificate and RoHS certificate. 3. How long does it take to deliver after order? For small quantity, we arrange delivery within one week normally while for big quantity, we will arrange delivery as soon as possible according to actual situation and customer's requirements. 4. What about your after-sale service? We fully guarantee our product quality and will provide free technical guidance on operations. |