Dust-free and Electrostatic-proof IC Isolation Paper for Electronic wafer Gasket

Dust-free and Electrostatic-proof IC Isolation Paper for Electronic wafer Gasket

Black wafer gasket isolation paper is made of polyethylene with unique technology. It can isolate wafers by anti-static and dust-free treatment. It has obvious characteristics of anti-static and dust-free. The product also has the characteristics of neutral PH value, waterproof, chemical inertia, no chip drop, strong and durable. It is the preferred chip isolation for chip manufacturing and packaging enterprises.

Product Characteristics

1. Antistatic

2. Dust-free, no debris

3. Toughness and durability

4. Chemical inertia

5. Non-toxic and non-chemical residues, thoroughly solve AMC (gas molecular pollutants) and VOC (volatile organic compounds) pollution

6. Anti-skid design of embossing

Product specification

We have 4 inches, 5 inches, 6 inches, 8 inches, 10 inches, 12 inches black wafer gasket isolation paper, surface resistance of 10 7-10 ohms, static discharge time: <1.0sec. Specific specifications are as follows:
Type, shape, dimension, thickness, quantification
4 inches round, 100 mm in diameter, 0.1 mm, 20,000 pieces
5 inch round, 125 mm in diameter, 0.1 mm, 20,000 pieces
6 inch round, 155 mm in diameter, 0.1 mm, 10,000 tablets
8 inch round 200 mm 0.1 mm 10,000 pieces
10 inches round 254 mm diameter 0.1 mm 10,000 pieces
12 inches round, 300 mm in diameter, 0.1 mm, 10,000 piece