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Durable using low price thermal resistance polycrystalline diamond dust power
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Meorient Import & Export Co.LTD
China - Hangzhou
Trading Company
Trade Capacity
Export Percentage
Nearest Port
Hangzhou,Shanghai
Accepted Delivery Terms
Employees
5-10人
Accepted Payment Currency
USD,CNY
Average Lead Time
45 Day(s)
Certifications
Product Specifications
--Product Description
Specification
Name | Detonation Polycrystalline Diamond Powder |
Features | High wear resistance and long service life |
Materials | Diamond |
Sample | Sample Provided |
Packing | Packing |
Advantage | factory wholesale |
Place of Origin | Beijing China |
Usage | Grinding and lapping |
Capacity | Large |
Logistics information | customers' requirements |
GRISH detonation polycrystalline diamond powder (PCD) is produced in a controlled explosion. Grains microscopic structure is similar with natural Carbonado.
Compared with monocrystalline diamond, PCD has more cutting edges, resulting in the higher removal rate, with good self-sharpening proprieties. The structure will always open new sharp edges introduced by releasing an outer layer of dull crystallites. The polycrystalline diamond can give higher removal rate and lowest level of scratches. That’s why it is especially suitable for the high precision processing on super hard material.
Application
Optical glass and crystal Sapphire and SiC wafer Ceramic metal
Features：
1.Higher toughness and better self-sharpening properties compared with monocrystalline diamond.
2. Higher removal rate, less scratches, more consistent polishing performance compared with monocrystalline diamond.
3.Long life and highyield.
4.High wear resistance and long service life.
Model | Grade | D10 (µm) | D50 (µm) | D95 (µm) | Areas of use |
PCD 1/8 | Standard size | ≥0.06 | 0.10-0.14 | ≤0.21 | Surface polishing of optical crystal, ultra-hard ceramic, wafer substrate and metal. |
PCD 1/4 | ≥0.11 | 0.20-0.25 | ≤0.40 | ||
PCD 0-1 | ≥0.40 | 0.48-0.55 | ≤0.72 | ||
PCD 0-2 | ≥0.70 | 0.90-1.10 | ≤1.50 | ||
PCD 2-4 | ≥1.80 | 2.70-3.00 | ≤4.50 | Lapping, rough polishing and back thinning of sapphire and SiC wafer substrate. | |
PCD 3-6 | ≥2.80 | 4.00-4.40 | ≤7.00 | ||
PCD 4-8 | ≥4.00 | 5.50-6.00 | ≤8.60 | ||
PCD 5-9 | ≥4.70 | 6.30-7.00 | ≤10.00 | ||
PCD 5-12 | ≥5.20 | 7.20-7.80 | ≤13.00 | ||
PCD G3 | Precision size | ≥2.00 | 2.80-3.10 | ≤4.40 | |
PCD G3.5 | ≥2.40 | 3.30-3.60 | ≤5.00 | ||
PCD G4 | ≥2.90 | 3.90-4.20 | ≤6.00 |
FAQ
Q1: Are you trading company or manufacturer ?
A: We are manufacturer.
Q2:What will be the delivery cost?
A:All price listed are FOB Beijing. Your nominated courier is acceptable. Otherwise, we will use FEDEX, DHL, UPS or any other forwarder per confirmation and charge accordingly
Q3:Can I have our own logo on the products?
A: That's ok to have your own logo on the products.(OEM\ODM) Please contact with us to make sure the detailed things before placing order.
Q4:How about your delivery date?
A: Delivery date is about 3-5days, it depends on the order quantity
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