Optical CCD lens
Imported optical CCD lens, High resolution alignment system for precisely mounting BGA and Components. Mounting accuracy is within 0.01 mm.
DH-A2 is automatic BGA Rework Station Motherboard Rework Station for TV llaptop top PS3 Xbox360 Cell phone
﹡ Widely used in Chip Level Repairing in llaptop top, PS3, PS4, XBOX360, Moblie Phone, Computer, TV, control boards etc.
﹡ Rework BGA, CCGA, QFN, CSP, LGA, SMD, LED etc.
﹡ Automatic desoldering, Mounting and Soldering, automatic pick up chip when desoldering completed.
﹡ HD CCD Optical Alignment system for precisely mounting BGA and Components.
﹡ BGA mounting accuracy within 0.01mm , Repair success rate 99.9%.
﹡ Laser Positioning for Fast Positioning BGA Chip and motherboard.
﹡ Superior Safety Functions, with Emergency protection.
﹡ User-friendly operation, Multi-functional ergonomic system.
Specifications | ||||||
1 | Total power | 5300w | ||||
2 | 3 independent heaters | Top hot air 1200w, lower hot air 1200w, bottom infrared preheating 2700w | ||||
3 | Voltage | AC220V±10% 50/60Hz | ||||
4 | Electric parts | 7’’ touch screen + high precision intelligent temp control module + stepper motor driver + PLC + LCD display + high resolution optical CCD system + laser positioning | ||||
5 | Temperature control | K-Sensor closed-loop + PID automatic temp compensation + temp module, temp accuracy within ±2℃. | ||||
6 | PCB positioning | V-groove + universal fixture + movable PCB shelf | ||||
7 | laptop plicable PCB size | Max 370x410mm Min 22x22mm | ||||
8 | laptop plicable BGA size | 1*1mm~80x80mm | ||||
9 | Dimensions | 600x700x850mm (L*W*H) | ||||
10 | Net weight | 70 Kg |
◆ Precise optical alignment system
① Color optical system with functions of split vision, two color separation, zoom in/out and micro-adjust, equipped with aberration detection device, with auto focus and software operation
② CCD camera amplify up to 200x, with top/down light brightness adjust function, mounting accuracy is within 0.01 mm
◆ Advanced features
① Top hot air flow is adjustable, to meet the demand of any chips.
② Desoldering, mounting and soldering automatically.
③ Built-in infrared laser positioning, help fast positioning for PCB.
④ Top heating head and mounting head 2 in 1 design.
⑤ Mounting head with built-in pressure testing device, to protect the PCB from being crushed.
⑥ build-in vacuum in mounting head pick up BGA chip automatically after desoldering completed.
◆ Three independently controlled heaters
① top and bottom heaters are hot-air heating, the third is infrared preheating zone, the top and bottom heaters can set 8 segments rising temperature/constant time/temperature rising slope , can save tens of thousands of groups temperature curves.
② it can heat PCB board and bga chips at the same time. And the third IR heater can preheat the PCB board from bottom evenly, to avoid PCB from deformation during repair process. All three heaters can heat independently .
③ It uses k-type thermocouple closed-loop control and PID automatic temperature compensation system, together with PLC and temperature module to enable precise temperature deviation to ±2 degree centigrade.
④ The external sensor can detect temperature precisely, analyze and calibrate the real temperature curve accurately at any time.
◆ Multi-functional ergonomic system
① bottom heater can be adjusted up and down.
② Adopted all kinds of magnetic top and bottom nozzles, with 360° rotation, easy for installation and replacement, customized sizes are available.
③ Multi-functional PCB support shelf, can be moved along X axis, together with universal fixture and V-groove bracket, suitable for all kind of PCB positioning.
④ powerful cross-flow fan automatically cool the PCB board fast after desoldering or soldering completed, it can prevent the heaters from aging. Fan will be shut down automatically when the heaters temperature drops to normal temperature.
◆ Superior safety functions
Machines are CE certification guaranteed. It is equipped with emergency button. Also there is voice warning around 5 seconds before soldering/desoldering process complete. With automatic power-off protection device when abnormal accident hlaptop pens, with a double over-heating protection control.
It is the most key factor for whether a chip can be reworked well.
Precise PID for temperature and time calculated and adjusting.
when automatic, setting parameters , PLC controlling, just click "start" to work.
Software inside is developed and researched by professional engineers in our company.
The nozzles and stencils can be customized, reballing kit and stencils with 80*80 mm, or 90*90 mm, solder ball with size from 0.2 ~ 0.76 mm, lead or lead free, heaters can be choose 110~ 250 V for different country's power standard.
Delivery | ||
◆ BGA rework station woulde be sent within 5 business days after receiving full payment. 2 working days for order 1~5 sets, 5~10 days for massive order. ◆Shipping By DHL, FedEx, TNT, EMS, UPS express. ◆when quantity is more than 50 sets , we suggest you choose sea shipment. For any more details, please click HERE |
Certification and patents for automatic BGA rework station
About BGA rework station's quality , soldering or desoldering result as below, hot air flow procedure, and which chip bga rework machine can repair as below, please just check them, if any question, please click HERE
Factory inside and outside, workshop 3000 square meters, own CNC machines for any parts made, independent R&D department, office and different workshops for BGA rework station, screw locking machine and soldering station etc.
Foxconn, Huawei, BYD and Lenovo etc, are one of our customers, and more and more international companies are loreballing ng forward to cooperating with us, BGA rework station for mobile phone , computer , computer and other PCB repair is your first choosing brand.
Dinghua Technology is a leading manufacturer of BGA rework station, and have our own independent R&D, also, the biggest worksop in this industry in China.