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Die Attach die bonder bonding Machine for In line Package in China
  • Die Attach die bonder bonding Machine for In line Package in China

Die Attach die bonder bonding Machine for In line Package in China

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Meorient Import & Export Co.LTD
Meorient Import & Export Co.LTD
China - Hangzhou
Trading Company
Trade Capacity
Export Percentage
Nearest Port
Hangzhou,Shanghai
Accepted Delivery Terms
Employees
5-10人
Accepted Payment Currency
USD,CNY
Average Lead Time
45 Day(s)
Certifications
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Product Details
Product SpecificationsProduct Description
Product Specifications
--
Product Description
Overview
Quick Details
Condition:
New
Weight (KG):
680
Showroom Location:
Turkey, Malaysia
Video outgoing-inspection:
Provided
Machinery Test Report:
Provided
Marketing Type:
Ordinary Product
Warranty of core components:
2 years
Core Components:
PLC
Place of Origin:
Guangdong, China
Brand Name:
minderhightech
Warranty:
1 Year
Supply Ability
Supply Ability:
100 Unit/Units per Month
Packaging & Delivery
Application

Suitable for: SMD HIGH-POWER COB,part COM in-line package etc.

1,Full automatic up load and down load materials.
2,Module design,max optimization structure.
3,Full intellectual property right.
4,Picking die and Bonding die dual PR system.
5,Multi-wafer ring,dual glue ect configuration.
Die Attach die bonder bonding Machine for In line Package in China from China supplier
Die Attach die bonder bonding Machine for In line Package in China from China supplier
Die Attach die bonder bonding Machine for In line Package in China from China supplier
Die Attach die bonder bonding Machine for In line Package in China from China supplier
Die Attach die bonder bonding Machine for In line Package in China from China supplier
Specification
Bonding workstage
Load ability
1 piece
XY stroke
10inch*6inch(working range 6inch*2inch)
Accuracy
0.2mil/5um
Dual work stage can feed continuously
Wafer workstage
XY travel stroke
6inch*6inch
Accuracy
0.2mil/5um
Wafer position accuracy
+-1.5mil
Angle accuracy
+-3 degree
Die dimension
5mil*5mil-100mil*100mil
Wafer dimension
6inch
Picking up range
4.5inch
Bonding force
25g-35g
Multi wafer ring design
4 wafer ring
Die type
R/G/B 3type
Bonding arm
90degree rotary
Motor
AC servomotor
Image recognition system
Method
256 gray scale
Check
ink dot,chipping die,crack die
Display screen
17inch LCD 1024*768
Accuracy
1.56um-8.93um
Optics magnification
0.7X-4.5X
Bonding cycle
120ms
Number of program
100
Max die number on one substrate
1024
Die lost check method
vacuum sensor test
Bonding cycle
180ms
Glue dispensing
1025-0.45mm
Die lost check method
vacuum sensor test
Input voltage
220V
Air source
min.6BAR,70L/min
Vacuum source
600mmHG
Power
1.8kw
Dimension
1310*1265*1777mm
Weight
680kg
Detail
Die Attach die bonder bonding Machine for In line Package in China from China supplier
Die Attach die bonder bonding Machine for In line Package in China from China supplier
Die Attach die bonder bonding Machine for In line Package in China from China supplier
Die Attach die bonder bonding Machine for In line Package in China from China supplier
Our Factory
Die Attach die bonder bonding Machine for In line Package in China from China supplier
Die Attach die bonder bonding Machine for In line Package in China from China supplier
Packing & Delivery
Die Attach die bonder bonding Machine for In line Package in China from China supplier
Die Attach die bonder bonding Machine for In line Package in China from China supplier
If you want to konw more,please contact our sales engineer:
Die Attach die bonder bonding Machine for In line Package in China from China supplier
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Send Enquiry
To: Lily Liu
Meorient Import & Export Co.LTD
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