Diamond Grinding Wheels for Sapphire Wafer
Diamond Grinding Wheels for Sapphire Wafer
DiamondGrinding (used for silicon ingot sapphire, SiC, GaN etc. High-material surface grinding)
According to the characteristics of the processed materials. Resin, Metal, Vitrified and electroplated bond with the grinding wheel types to choose from. we can provide the different size if you have different need.
Grinding wheel for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer,gallium aresenide and GaN wafer.
If you want this products, please give me some informations, as belows:
1.Wheel
a. Type
b. Dimension
c. Grit Size
d. Bond
2. Workpiece
a. Material
b.Hardness:
c. Remove stock
d.surface roughness
3.Grinding Condition:
a. Spindle Speed
b.Feed Rate
C. Depth of Cut
d.Cycle Time
e. Dressing Cycle
F. Dressing Depth
Qualification:
If you have any Questions or requirements, please feel free to Contact me!
contact name :chris
whatsapp:0086 18676055357
skype :chrisly520
TEL:+86-371-6099883
website:www.cnsyntheticdiamond.com
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