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This machine is for repairing motherboard IC/Chip/Chipset of Laptop, Mobile, PC, iPhone, Xbox, etc. With features 3-heater(2xHot air+IR Preheating), embedded Smart PC, Auto Profile, Cooling Fan, Micro hot-air adjustment, Vacuum Pick-up & Place, Universal Support for most of the PCB Size/Shape.
SPECIFICATIONS | ||||||
Total Power | 4800W | |||||
Top heater Power | 800W (1st Hot air heater) | |||||
Bottom Heater | 1200W(2nd hot air heater), 2800W (IR preheat) | |||||
Temperature Accuracy | ±2℃ | |||||
Power Supply | AC220V±10% 50Hz | |||||
Dimension | 700x760x580mm (L*W*H) | |||||
Temperature Profile Storage | 50,000 groups | |||||
Operation Mode | Manual+Touchscreen | |||||
PCB Support | V-groove + universal fixture + 5-points support + Adjustable in X direction | |||||
Temperature Control | K-type Thermocouple + Closed Loop | |||||
PCB Size | Max.410x370mm, Min. 22x22mm | |||||
BGA Chip | 2x2mm-80x80mm | |||||
Minimum Chip Spacing | 0.15mm | |||||
External connector for temperature testing | 1pcs or Customized | |||||
Net Weight | 35KG |
Packaging | ||
Size | 70(L) * 776(W) * 58(H) | |
Weight | 62Kg | |
Packaging Details | The normal package is wooden box(Size: L*W*H). If export to european countries,the wooden box will be fumigated. We will also use pe film for packing or pack it according to customers special request. |