Base Material | FR4 / Metal based / Shengyi /KB / ITEQ / Rogers 4350, etc |
Board Thickness | 0.2-7mm / Regular 1.6mm |
Solder Mask Color | Blue / Green / White / Black / Red / Yellow |
Silkscreen Color | Blue / Green / White / Black / Red / Yellow |
Number of Layers | 1-24 Layers |
Copper | 1-6OZ |
Surface Treatment | HASL Leaded /HASL Lead-free / OSP |
ENIG / ENEPIG / Immersion Silver / Immersion Tin | |
Customer Group | Communications / Automotive and equipment for automotive |
Industrial applications / Industries applications/ High-tech applications | |
"New Energy”-applications / Consumer applications | |
Min. Space / Track | 3 / 3mil |
Min. Hole Size | Mechanical Hole: 0.15mm, Laser Hole: 0.1mm |
Service | One-stop service |
Impedance Control | +/- 5% |
Plugging Vias Capability | 0.2-0.8mm |
Products Testing | E-test Fixture / Model, X-ray Inspection, AOI Test, Functional Test |
MOQ | 1pcs |
Production | Prototypes / Little to Mass production |
Files needed | PCB gerber 274x file / PCBDOC |
Components: Bill of Materials (BOM list) | |
Assembly : Pick-N-Place file | |
PCB Panel Size | Min. Size: 0.25*0.25 inches (6*6mm) |
Max. size: 1200*600mm | |
Components Details | Passive Down to 0201 size |
BGA and VFBGA | |
CSP Leadless Chip Carriers / CSP | |
Double-sided SMT Assembly | |
Fine Pitch to 0.8mil | |
BGA Repair and Reball | |
Part Removal and Replacement | |
Component package | Cut Tape, Tube, Reels, Loose Parts |
PCB+ assembly process | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave |
Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing |