conductive s paint/adhesive
for printed circuit boards whose substrate is ceremics, alumina,glass
cure time:15min ,baked at 120 °C
Features
One-component
Medium viscosity
High- bonding strength conductive adhesive
Parameters
Color: Silver
Specific Gravity: 3.83
Viscosity: 480kCPS (23°C, 10rpm)
Hardness: 65
Decomposition temperature: 380 °C
Glass transition temperature: 97 °C
Shear strength: more than 3000psi
Impact strength: more than 10Kg/5000psi
Thermal expansion coefficient: higher than the glass transition temperature of 100e-6TH
Operating temperature: -55 °C~600
TG: 200 °C / 0.22%; 300 °C / 0.65%; 400 °C / 2.6%
Volume Resistance: 0.00013 Ohm - cm
Thermal conductivity: 17.8W/mOk
Curing condition: 150 °C 60min
Shelf life: 0 °C 3 months; -15 °C 6 months
Note: can be properly stirred at room temperature to use.