Compact Reflow Solder System for different atmospheres for vacuum with inert gas and formic acid

Compact Reflow Solder System for different atmospheres for vacuum with inert gas and formic acid

The Reflow Solder System RSS is developed for a small budget and space purpose. It

is an excellent tool for various solder processes and other applications. Some applications

are: as laboratory solder system for all kind of developers implementing and researching new processes, e.g. fluxless soldering, flip-chip process, adhesive bonding, hermetic sealing under controlled atmospheres, solder bump reflowing, encapsulation of housings, soldering of power devices, heat treatment of semiconductor wafers, prototype research, quality control, environ- mental research purposes and for small pre-series or series. The chamber is hermetically

sealed.  The total heated area is 630 mm x 210 mm for parellel processing of up to 12 wafers with 100 mm diamter each. The maximum temperature is up to 300 °C.

One gas line with manual adjustable flow meter and digital display (electrical measured) is default, up to 4 gas lines are optional available. By using the formic acid option (RSS-FA) the carrier gas (e.g. Nitrogen) will be enriched with formic acid vapour and fed into the process

chamber. This supports fluxless soldering by removing of thin oxide layers from the surfaces. As

an alternative we offer the option RSS-H2 (hydrogen module) which allows the usage of 100%

pure hydrogen. Standard (inert) gases to be used are nitrogen or forming gas.

By connecting an appropriate external vacuum pump the system is vacuum capable up to

10-3 mbar.

Key features are precise controlled fast ramp rates up to 120 K/min for ramp up and up to

60 K/min for ramp down (depending on loading).

The process is programmed by the internal controller which is provided with the UniSoft Software. The process is controlled either directly at the controller (a display shows the current status) or by using the USB to PC interface. This allows storage of an unlimited

number of programs. So all temperature profiles and segments can be saved. An additional feature is the choice between precisely programming the ramp-rate or the time-to-target value.

This tool is a low cost solution for various applications and industries. A further advantage

is the minor size of the system.

Heated area: 210 x 630 mm

Temperature range: up to 300 °C

Ramp up rate : up to 120 K/min

Ramp down rate: up to 60K/min

Interface: USB incl. UniSoft(ware)

Controller: Eurotherm 2604

Programs: 20 programs storable, each with 100 segments

Overall dimensions: 820 x 630 x 315 mm (LxWxH), with open/close mechnism, with vacuum connector

Weight chamber: about 100 kg

Connected load18 kW

Voltage: 230 V, 3 ~, +N

Current: max. 3 x 32 A

Safety class system : IP20

Temperature: 0 C - +40 C (operating) / -20 C - +60 C(storage)

Humidity: 10% - 90% non-condensing,

Oper. Altitude: 0 ~ 3,000 m or 10,000 ft

Options and accessories:

RSS-FM-EL: Additional gas line with manual adjustable flow meter with digital display

RSS-MFC: Additional gas line with mass flow controller (internal, max. 2)

RSS-MP: Diaphragm pump for vacuum up to 10 mbar with manometer

RSS-MPC: Chemcial resistant diaphragm pump for vacuum up to 10 mbar with manometer

RSS-RVP: Rotar y vane pump for vacuum up to 10-3  mbar with oil filter and manometer

RSS-FA: Formic acid module (integrated in machine)

RSS-H2: Hydrogen module with electrical flow meter

RSS-H2S: Hydrogen safety device with cover and sensor

RSS-IL: Interlock mechanism for unintended opening of the chamber during the process

RSS-TC: Additional thermocouple to measure on device (max. 6 pcs), for external measure- ment tool

RSS-VM: Vacuum measurement with vacuum sensor and data logging, up to 10-3  mbar

RSS-WC: Closed loop water cooling system (stand alone)