PCB&PCBA Capacity | ||||
1 | Material | FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI Material, BT Material, PPO, PPE etc. | ||
2 | Board thickness | Mass production: 394mil(10mm) Samples: 17.5mm | ||
3 | Surface finish | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger | ||
4 | PCB Max panel size | 1100mm × 610mm | ||
5 | Layer | Mass production: 1~16 layers / Pilot run: 16 layers, Flexible PCB: 1-12 Layers | ||
6 | Min hole size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) | ||
7 | PCBA QC | X-ray, AOI Test, Functional Test | ||
8 | Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. | ||
9 | Our service | PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 16 layers | ||
10 | Sanforized | Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control. | ||
11 | SMT Capacity | 500Million Points/Day | ||
12 | DIP Capacity | 0.3Million Points/Day | ||
13 | Certificate | RoHS/ISO9001/TS16949/UL/ISO14001/ISO13485 |