Laminate Materials | FR4, high TG FR4, high frequency | |||
Board Cutting | Number of layers | 1-48 | ||
Min.thickness for inner layers | 0.003”(0.07mm) | |||
(Cu thickness are excluded) | ||||
Board Thickness | Standard | (0.1-4mm±10%) | ||
Min. | Single/Double0.008±0.004” | |||
4layer0.01±0.008” | ||||
8layer0.01±0.008” | ||||
Bow and twist | no more than 7/1000 | |||
Copper Weight | Outer Cu weight | 0.5-6 0z | ||
Inner Cu weight | 0.5-3 0z | |||
Drilling | Min size | 0.00393"/ 0.1mm(4mil) | ||
Drill deviation | ±0.002″(0.05mm) | |||
PTH hole tolerance | ±0.002″(0.005mm) | |||
NPTH hole tolerance | ±0.002″(0.005mm) | |||
Solder Mask | Color | Green,white,black,red,blue… | ||
Min solder mask clearanace | 0.003″(0.07mm) | |||
Thickness | (0.012*0.017mm) | |||
Silkscreen | Color | white,black,yellow,blue… | ||
Min size | 0.006″(0.15mm) | |||
Component Sourcing | Yes | |||
Tolerance of PCB | ±5% | |||
Max Size of Finish Board | Min 5*6mm | Max 609*1100mm | |||
MOQ | 1pcs | |||
Detailed Terms for Pcb Assembly | ||||
Quantity | Prototype&sample PCB Assembly, Small and middle mass prodution is our specialty and we also can handle the orders up to 2000. | |||
Type of Assembly | THD (Thru-Hole Device), SMT (Surface-Mount Technology), Double-sided SMT & THD mixed | |||
Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free. | |||
Components | Passives parts, smallest size 0201; | |||
BGA, uBGA, QFN, POP, and Leadless chips; | ||||
Fine Pitch to 0.8Mils; | ||||
BGA Repair and Reball; Part Removal and Replacement | ||||
Connectors and terminals. | ||||
Bare Board Size | Smallest 0.25x0.25 Inches; Largest 20x20 Inches. | |||
File Formats | Bill of Materials Gerber Files Pick-N-Place File(XYRS). | |||
Type of Service | Turn-Key, Partial Turn-Key or Consignment. | |||
Component Packaging | Reels,cut tape,Tube and tray,Loose parts and bulk. | |||
Turn Time | 3 - 15 days | |||
Testing | X-ray Inspection | |||
AOI (Automated Optical Inspection) | ||||
ICT (In-Circuit Test)/Functional Testing | ||||
products are widely used in telecommunications,computing networks,medical equipment,Auto and other high-tech fields. |
Lead Time | ||||
Item | Sample Lead time(D) | Mass Production Lead time(D) | ||
Single Sided PCB | 1-3 | 4-7 | ||
Double Sided PCB | 2-6 | 7-12 | ||
Multilayer PCB | 7-10 | 9-16 | ||
PCB Assembly | 8-15 | 16-30 |