Ceramic Thermal Pad Insulator For Transistor To-220 To-247 To-3P To-264 Isolador Cermico

Thermal Conductive Ceramic Sheet

The thermal conductivity of the ceramic sheet is as high as 24W / M.K. it is resistant to high temperature and high pressure. The surface of the ceramic sheet is smooth without burr and burr. It is heated evenly and dissipates heat quickly; Simple and compact structure, small size, high strength, not easy to break, acid and alkali corrosion resistance, durable

Typical applications:  

1. IC / MOS / triode

2. Surface heat source for diode and IGBT

3. High density switching power supply

4. High frequency communication equipment

5. High frequency welding machine and other equipment

Ceramic heat sink is a green environmental protection material. It belongs to microporous structure, which can increase the porosity by 30% under the same unit area, greatly increasing the heat dissipation area in contact with air and enhancing its heat dissipation effect. At the same time, its heat capacity is small, its own heat storage capacity is small, and its heat can be transmitted to the outside world more quickly. The main characteristics of ceramic heat sink are environmental protection, insulation, high voltage resistance, efficient heat dissipation, and avoiding EMI problems. It can
effectively solve the heat conduction and heat dissipation problems in the electronics and home appliance industries. At the same time, it is especially suitable for products with small and medium watt power consumption and light, thin, short and small design space. It can provide technical support and application for the innovation and development of electronic products.

Product Features: 

1. Electronic insulation and avoiding EMI problems

2. Light weight, high surface area, good heat radiation, no heat storage and fast heat dissipation

3. Resistant to cold and heat shock, easy to install, no quality problem of long-term storage

4. It is an environmentally friendly material and process product, friendly to the environment

Typical applications: 

1. LED backlight module
2. Thin LCD TV set top box
3.  AP, Router, ADSL, Modern, S / W, STB Information Technology: M / B, NB, Video, Card
4: DDR3-DIMM, SO-DIMM, SSD
5: Power module, power transistor

Aln Ceramic Pad

The thermal conductivity of AlN ceramic sheet is 180W / m.k, which is 7-10 times of that of alumina ceramic. Excellent mechanical properties, good machinability, high dimensional accuracy, smooth surface, no micro cracks, bending and so on. Low dielectric constant and dielectric loss, reliable electrical insulation performance. It is nontoxic, 1800 ℃ resistant, oil resistant, chemical resistant, and has the same coefficient of thermal expansion as silicon, no hygroscopicity, and stable performance under high temperature and high humidity conditions. With the wide development of microelectronic equipment, high thermal conductivity AlN ceramic chip as a matrix material or packaging material has been widely valued and applied

Product features:    

1. High thermal conductivity, high voltage insulation
2. High temperature and humidity resistance
3. Good mechanical properties, high bending strength
4. Low dielectric, effective anti electronic signal interference

Typical Applications:

1. Optoelectronic communication device
2. High frequency microwave application device
3. Automotive electronics module
4. Application of Aerospace Military Electronics
5. LED / high power module

Shenzhen Union Tenda Technology Co., Ltd. was established in 2011,registered capital of 10 million, with an independent industrial park covering an area more than 10,000 square meters.which is a professional high-tech enterprise engaged in R&D,production and sales of thermal interface materials. Our team dedicated to the research and development of thermal conductivity materials, equipped with a dust-free workshop, automatic metering and feeding system, multiple automatic thermal conductivity material production lines, a testing center and four independent laboratories. The main raw materials are selected from Japan Electrochemical, Dow Corning, Shin-Etsu, etc. brand. We Obtained ISO9001 / ISO14001 / ISO45001 / IATF16946 certification. All our products are passed ROHS, REACH and UL. Our main products contain thermal pad,thermal gel,thermal ceramic plate,thermal potting compound etc.It’s widely used in smart terminals, smart homes, power supplies, communications, new energy vehicles, wearable devices and other industries. The company is now cooperating with Flextronics, DBK, Foxconn, Guangyu, Asteel Flash Group , BYD , HKC and other Companies , with annual sales reaching 100 million. We are honest to business,welcome to get some samples compare to others. We are reliable supplier of thermal interface materials.