skype:Miya zhang
Technology capability
Item | Capability | Item | Capability |
Layers | 1-28 | Thicker Copper | 1-6oz |
Products Type | HI(High-Frequency)&(Radio Frequency) board, Imedance controlled board,HDI board, BGA& Fine pitch board | solder mask | Nanya&Taiyo, LPI&Matt red, green,yellow,white,blue,black. |
Base Material | FR4(Shengyi China, ITEQ, KB A+,HZ),HI-TG,Fr06,Rogers,Taconic,Argon,Naclo,Isola and so on | Finished Surface | Conventional HASL, Lead-Free HASL,Flash Gold,ENIG(Immersion Gold),OSP(Entek),Immersion Tin, Immersion Sliver, Hard Gold |
Selective Surface Treatment | EING(Immersion Gold)+OSP, ENIG(Immersion Gold)+Gold Finger, Flash Gold Finger, Immersion Sliver+Gold Finger, Immersion Tin+Gold Finger | ||
Technical Specification | Minimum line width/gap | 3.5/4mil(laser dirll) | |
Minimum hole size | 0.15mm(mechanical dirll) 4mil(laser dirll) | ||
Minimum Annular Ring | 4mil | ||
Max Copper Thickness | 6oz | ||
Max Production Size | 600mm*800mm | ||
Board Thickness | D/S:0.2-7.0mm, Multilayer:0.4-7.0mm | ||
Min Solder Mask Bridge | ≥0.08mm | ||
Aspect Ratio | 15:1 | ||
Plugging Vias Capability | 0.2-0.8mm | ||
Tolerance | Plated holes Tolerance | ±0.08mm(min±0.05) | |
Non-Plated Hole Tolerance | ±0.05mm(min+0/-0.05mm or +0.05/-0mm) | ||
Outline Tolerance | ±0.15mil(min±0.10mm) | ||
Functional Test | |||
Insulating Resistance | 50ohms(normality) | ||
Peel Off Strength | 1.4N/mm | ||
Thermal Stress Test | 265℃,20seconds | ||
Solder Mask Hardness | 6H | ||
E-test Voltage | 500V+15/-0V 30s | ||
Warp and Twist | 0.7%(Semiconductor test board 0.3%) |
PCB Features
* Low water absorption rate
* Hard to be deformed
* High mechanical strength
* Good electric performance wether under the moist or dry environment, Flame retardant grade could reach 94-V0
* High temperature resistant,high dielectric performance and mechanical processing performance.
PCB manufacture and PCB assembly
* PCB board file with parts list provided by customer
* PCB board made, circuit board parts purchased by us
* PCB board with parts assembled
* Electronic testing circuit board or PCB
* Fast delivery, anti-static package
* RoHS Directive-compliant, lead-free
* One stop service for PCB design, PCB layout, PCB manufacture, components purchasing, PCB assembly, test, packing and PCBdelivery
PCB manufacturer Testing procedures
* Visual Inspection
* Flying probe
* Impedance control
* Solder-ability detection
* Digital metallograghic microscope
*AOI (Automated Optical Inspection)
How to get a quote?
--- Pls send BOM and gerber file with these format: .PCB / .P-CAD / .DXP / .CAD / .Gerber
* Base material: FR4/ AL/ FPC/ CEM-1/ CEM-3/ 94v0/ Rogers
* Board thickness: 1.6mm-3.2mm/ 0.3mm-1.2mm
* Copper thickness: Hoz/ 1oz/ 2oz/ 3oz/ 4oz, ect
* Surface treatment: HASL/ ENIG/ LF-HAL/ Immersion Tin/ Immersion Sin/ OSP
* color of solder mask and silkscreen: Green/White/Black/Red/Blue/Yellow
* Quantity and board size
What we need
*For PCB enquiry, gerber file or any other pcb production file is needed. Any details are also welcomed if no Gerber file,
such as schematic or a sample.
*For PCBA enquiry,BOM(Bill of Materials) is needed besides.
*Reverse engineering and PCB clone services are available if given a sample.
Our PCBA manufacture service:
* PCBA, PCB assembly: SMT & PTH & BGA
* PCBA and enclosure design
* Components sourcing and purchasing
* Quick prototyping
* Plastic injection molding
* Metal sheet stamping
* Final assembly
* Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
Technical requirement:
* Professional Surface-mounting and Through-hole soldering Technology
* Various sizes like 1206,0805,0603 components SMT technology
* I CT(In Circuit Test),FCT(Functional Circuit Test) technology.
* PCB Assembly With UL,CE,FCC,Rohs Approval
* Nitrogen gas reflow soldering technology for SMT.
* High Standard SMT&Solder Assembly Line
* High density interconnected board placement technology capacity.