Min. Hole Size | 0.3mm |
Min. Line Width | 0.1mm |
Min. Line Spacing | 0.1mm |
Min Assembly Specification | 50mm*50mm |
Max Assembly Specification | 510mm*460mm |
Min device accuracy | +/- 0.04mm |
Min footprint distance | 0.3mm |
Components DIP | 01005 Chip/0.35 Pitch BGA |
Material | FPC, FR4, Rigid-flex pcb, mcpcb |
Surface Finishing | HASL,Immersion gold,Flash gold, plated silver, OSP |
Application | Telecommunication, Computer Application, Consumption Electronics |