BGA Rework Station motherboard reballing machine for TV llaptop top mobile phone A2E, some of products can be used for this machine to be repaired, such as, computer, multi-media and set top box, mobile phone and defence & aerospace etc.
﹡ Widely used in Chip Level Repairing in llaptop top, PS3, PS4, XBOX360, Moblie Phone, Computer, TV, control boards etc.
﹡ Rework BGA, CCGA, QFN, CSP, LGA, SMD, LED etc.
﹡ Automatic desoldering, Mounting and Soldering, automatic pick up chip when desoldering completed.
﹡ HD CCD Optical Alignment system for precisely mounting BGA and Components.
﹡ BGA mounting accuracy within 0.01mm , Repair success rate 99.9%.
﹡ Laser Positioning for Fast Positioning BGA Chip and motherboard.
﹡ Superior Safety Functions, with Emergency protection.
﹡ User-friendly operation, Multi-functional ergonomic system.
Specifications | ||||||
1 | Total power | 5400w | ||||
2 | 3 independent heaters | Top hot air 1200w, lower hot air 1200w, bottom infrared preheating 2700w | ||||
3 | Voltage | AC220V±10% 50/60Hz | ||||
4 | Electric parts | 7’’ touch screen + high precision intelligent temp control module + stepper motor driver + PLC + LCD display + high resolution optical CCD system + laser positioning | ||||
5 | Temperature control | K-Sensor closed-loop + PID automatic temp compensation + temp module, temp accuracy within ±2℃. | ||||
6 | PCB positioning | V-groove + universal fixture + movable PCB shelf | ||||
7 | laptop plicable PCB size | Max 370x410mm Min 22x22mm | ||||
8 | laptop plicable BGA size | 2x2mm~80x80mm | ||||
9 | Dimensions | 600x700x850mm (L*W*H) | ||||
10 | Net weight | 70 Kg |
◆ Precise optical alignment system
① Color optical system with functions of split vision, two color separation, zoom in/out and micro-adjust, equipped with aberration detection device, with auto focus and software operation
② CCD camera amplify up to 200x, with top/down light brightness adjust function, mounting accuracy is within 0.01 mm
◆ Advanced features
① Top hot air flow is adjustable, to meet the demand of any chips.
② Desoldering, mounting and soldering automatically. Auto feeding system enabled.
③ Built-in infrared laser positioning, help fast positioning for PCB.
④ Top heating head and mounting head 2 in 1 design.
⑤ Mounting head with built-in pressure testing device, to protect the PCB from being crushed.
⑥ build-in vacuum in mounting head pick up BGA chip automatically after desoldering completed.
◆ Three independently controlled heaters
① top and bottom heaters are hot-air heating, the third is infrared preheating zone, the top and bottom heaters can set 8 segments rising temperature/constant time/temperature rising slope , can save tens of thousands of groups temperature curves.
② it can heat PCB board and bga chips at the same time. And the third IR heater can preheat the PCB board from bottom evenly, to avoid PCB from deformation during repair process. All three heaters can heat independently .
③ It uses k-type thermocouple closed-loop control and PID automatic temperature compensation system, together with PLC and temperature module to enable precise temperature deviation to ±2 degree centigrade.
④ The external sensor can detect temperature precisely, analyze and calibrate the real temperature curve accurately at any time.
◆ Multi-functional ergonomic system
① bottom heater can be adjusted up and down.
② Adopted all kinds of magnetic top and bottom nozzles, with 360° rotation, easy for installation and replacement, customized sizes are available.
③ Multi-functional PCB support shelf, can be moved along X axis, together with universal fixture and V-groove bracket, suitable for all kind of PCB positioning.
④ powerful cross-flow fan automatically cool the PCB board fast after desoldering or soldering completed, it can prevent the heaters from aging. Fan will be shut down automatically when the heaters temperature drops to normal temperature.
◆ Superior safety functions
Machines are CE certification guaranteed. It is equipped with emergency button. Also there is voice warning around 5 seconds before soldering/desoldering process complete. With automatic power-off protection device when abnormal accident hlaptop pens, with a double over-heating protection control.
Monitor screen, 15 inches, 1080 P, zoom in or out 10 times ~ 220 times, the dots on chip and PCB will be shown on it, and different colors , when two kinds of colors are concurrent, chip can be soldered .
When manual, it can let top head move upper or downward.
When automatic, it is controlled by PLC, which can stop automatically when touch any staff.
Zoom in or out : 10 ~ 220 times
4 heating tubes inside, for small PCB , 2 tubes working are OK,
The infrared heaters are fully enclosed in a glass-shielded compartment that quickly dissipates heat and prevents debris from falling into the elements, ensuring operator safety, reduced maintenance, and easy cleaning.
For date downloading or soft ware uploading, or the screenshot can be downloading for analysis .
Accurately temperature controlled , it is necessary condition for a chip /PCB to be reworked well .
Being able to create a new temperature profile or select the used temperature profile that have been saved .
8 segments in total, can be set more temperatures, time , which are useful for chip / PCB protected.
Delivery | ||
◆ Sample woulde be sent within 5 business days after receiving full payment. 7-15 days for bulk order. ◆ Shipping By DHL, FedEx, TNT, EMS, UPS express. You can also choose sea shipment. For the exact freight, please click HERE |
More details , please read the words and pictures as below
For quickly responce, you can add my social media as below: