BGA paste Flux For Mobile Phone Motherboard CPU BGA Chip Soldering Repair 30ML Flux
BGA paste Flux For Mobile Phone Motherboard CPU BGA Chip Soldering Repair 30ML Flux
Feature :
Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflow
No-clean and Lead free for environmental protection