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Aluminum PCB Assembly PCBA For Smart LCD TV Remote Control Circuit Board Mainboard Assembly Prototype PCB Assemble PCBA
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Meorient Import & Export Co.LTD
China - Hangzhou
Trading Company
Trade Capacity
Export Percentage
Nearest Port
Hangzhou,Shanghai
Accepted Delivery Terms
Employees
5-10人
Accepted Payment Currency
USD,CNY
Average Lead Time
45 Day(s)
Certifications
Product Specifications
--Product Description
Product Description
Specification
Material | FR4, High TG FR4, Rogers 4350/4003,Arlon,Taconic,Nelco,TP,Polyimide |
Type of Rigid PCB | Back Board, HDI, Blind Buried hole, Buried capacitor, Buried resistor, thick copper. |
Max Thickness | 394mil (10MM) |
Max. Panel Size: | 1150mmx560mm |
Surface Finish | HASL, HASL Lead-Free, Immersion/Plate gold, Goldfinger, OSP, AS, Sn, ENIG+OSP, ENIG+G/F, |
Line Width/Space | Inner Layer:1/2 OZ-10OZ; Out Layer:1/3 OZ-10OZ. |
Solder Mask Color: | Green, Yellow, Black, Blue, Red, Pink, White, Purple, Matt Green |
Silkscreen: | White, Yellow, Black |
Board Thickness: | 0.2-6.0MM |
Number of Layers: | 1-58Layers |
Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling and Resistance control. |
Packing & Delivery
To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
Company Profie
PCB Making
Layers: 1-58 layers
(Main advantages from 2 layers, 4layers 6 layers, 8 layers hdi to 20layers.)
Max.Thickness:
HASL lead free is 0.6-4.0mm; ENIG is 0.2-7.0mm; Siliver: 0.4-5.0mm;
Material: FR-4 TG170 TG180 in mass production
(Shengyi S1141,S1165,S1600, IT180A,etc.)
Min.Width/Spacing: 0.1mm in hdi, and 0.15-0.2mm for standard making.
Max.Copper Thickness: 0.5oz-12oz heavy copper
Min. Hole Size: Laser drill is 0.1mm-0.15mm | ±0.05mm (4-6mil±2mil)
Max. Panel Size: 1150mmx560mm
Aspect Ratio: 12:1 and 8:1 in mass production
Surface Finish: HASL lead free,Immersion Gold, Immersion Silver mainly.
Special Process:
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity,
Hybrid, Partial hybrid, Partial high density, Back drilling and Impedance control.
Layers: 1-58 layers
(Main advantages from 2 layers, 4layers 6 layers, 8 layers hdi to 20layers.)
Max.Thickness:
HASL lead free is 0.6-4.0mm; ENIG is 0.2-7.0mm; Siliver: 0.4-5.0mm;
Material: FR-4 TG170 TG180 in mass production
(Shengyi S1141,S1165,S1600, IT180A,etc.)
Min.Width/Spacing: 0.1mm in hdi, and 0.15-0.2mm for standard making.
Max.Copper Thickness: 0.5oz-12oz heavy copper
Min. Hole Size: Laser drill is 0.1mm-0.15mm | ±0.05mm (4-6mil±2mil)
Max. Panel Size: 1150mmx560mm
Aspect Ratio: 12:1 and 8:1 in mass production
Surface Finish: HASL lead free,Immersion Gold, Immersion Silver mainly.
Special Process:
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity,
Hybrid, Partial hybrid, Partial high density, Back drilling and Impedance control.
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