1. Appearance:
White water base suspension
2. Application:
Polishing semiconductor wafers, precision ceramic, metal and other materials.
3. Specification:
Size (micron) |
0.30,0.20,0.15,0.10 |
|
PH |
11-13 |
3.5-4.5 |
Content % |
19-22 |
29-31 |
Suspensibility |
good |
good |
4. Characteristics:
(1) High purity alumina particles dispersed in deionized water medium
(2) Higher hardness makes it have good grinding performances than silica polishing slurry, not only can achieve higher grinding effect, but also can get better surface roughness.
5. Package:
500g/bottle; 5kg/bottle
Hope to cooper ate with you! Pls contact me if any question.