9800 series 10kv silicon thermal pad for Heat sink

 Features:

1) Ultra Sof and High  Compressibility;

2) 4.0 W/m.k Thermal Conductivity;

3) Low Thermal Impedance;

4) V-0 Recognized;

5) Natural Sticky.

Applications:

1) Electronic Components: IC, CPU, MOS;

2) LED, M/B, P/S, Heat Sink, LCD-TV, Notebook PC, PC, Telecom Device, Wireless Hub etc;

3) DDR II Module/DVD Application/ Hand-set Application etc.

Thickness V.S Temperature Resistance V.S Breakdown Voltage:

UE357314

Available with adhesive backing, but the thermal conductive will be affected by the adhesive.

If customer do not have special request, the acquiescent adhesive , which thickness is 0.05mm.

Property:

Note: The above performance data for this product were tested in the environment of 70% humidity, temperature 25℃. It’s only for users’ reference. In a particular environment, it may can not achieve the above data. Users are requested to use their actual data from experiments while using our products. King Bali reserve all the right of interpretation for this product.

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