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8 Layer FR4 Electronic Multilayer HDI Laser Blind Buried Via PCB Board Fabrication
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Meorient Import & Export Co.LTD
China - Hangzhou
Trading Company
Trade Capacity
Export Percentage
Nearest Port
Hangzhou,Shanghai
Accepted Delivery Terms
Employees
5-10人
Accepted Payment Currency
USD,CNY
Average Lead Time
45 Day(s)
Certifications
Product Specifications
--Product Description
Product Description
Rigid PCB Production Capacility
|
Item |
Standard(mass production) |
Advanced(Sampling) |
|
Layers |
1-12Layer |
12-56Layer |
|
Final Board Thickness |
0.4-3.2mm |
0.2-7.00mm |
|
Max. Panel Size |
508*640mm |
610*1400mm |
| Material | CEM-3, FR-4, (High CTI, Halogen Free, high frequency), Metal base. |
CEM-3, FR-4, (High CTI, Halogen Free, high frequency), Metal base. |
|
Material Supplier |
KB, SY, NY, ITEQ, Uniplus, TUC |
Rogers, Arlon, Taconic, Nelco... |
|
Surface Finish |
LF-HASL, OSP, ENIG, Immersion Silver, Immersion Tin | LF-HASL, OSP, ENIG, Immersion Silver, Immersion Tin |
|
Impedance Control |
±10% ohm |
±10% ohm |
|
Min. Line Width/Space |
3/3mil |
3/2.5mil |
|
Max. Aspect Ratio |
10: 1 |
30:1 |
|
Copper Thickness |
18um, 35um, 70um, 105um |
140um(inner layer)-280um(outer layer) |
| Min. Finshed Hole Size |
0.2mm |
0.1mm |
|
Soler Mask |
Green, white, black, grey, blue(dark-blue, light-blue), pink, organge, Purple, red, yellow |
Green, white, black, grey, blue(dark-blue, light-blue), pink, organge, Purple, red, yellow |
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- Step 4Set up meeting with the Chinese supplier without language barrier