8.0W/m.k thermal conductivty silicone gel for circuit board pcb electronicsca gel
Thermal gel is a soft silicone based thermal gap filling material with high thermal conductivity, low interfacial thermal resistance and good thixotropy.It is filled between the electronic components to be cooled and the radiator/housing, etc., making them in close contact, reducing the thermal resistance, quickly and effectively reducing the temperature of the electronic components, thus prolonging their service life and improving their reliability.Thermal gels can be painted by hand or by dispensing equipment.
| Product Performance | Test Results | Test Method |
| Colour | Pink | visualization |
| Extrusion speed(30cc EFD cartridges 1 "office 90psi) | 10.0g/min | -- |
| Proportion | 3.4g/cm3 | Helium true density method |
| Volume resistance | >1013Ω.cm | ASTM D257 |
| Thermal conductivity | 8.0W/mK | ASTM D5470 |
| Dielectric breakdown strength | >200 VAC/mil | ASTM D149 |
| Dielectric constant | 5.5@1MHZ | ASTM D150 |
| Minimum interface thickness | 0.09mm | -- |
| Use temperature | -50~200℃ | -- |
| Storage time | 12month | -- |
| Content of D3 ~ D12 precipitated by small Silicon molecules | <300PPM | GB/T 27843-2011 |
| Thermal expansion coefficient | 175ppm/K | ASTM E831 |
| Flammability | V-0 | UL |
1. High thermal conductivity, low thermal resistance, excellent wetting
2. Soft, stress-free, infinitely compressed to a minimum of 0.1 mm
3. No settlement, no flow, can fill any uneven gap
4. Convenient design and application, with automatic glue machine can adjust any thickness size
5. Meet ROHS and UL environmental requirements
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