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Home > Products > Minerals & Metallurgy > Copper > Copper Bars
6N 99.99995% copper cathode plate for semiconductor packaging bonding wire
  • 6N 99.99995% copper cathode plate for semiconductor packaging bonding wire

6N 99.99995% copper cathode plate for semiconductor packaging bonding wire

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Meo Machinery Co.LTD
Meo Machinery Co.LTD
China - Hangzhou
Manufacturing and trade
Trade Capacity
Export Percentage
0-30%
Nearest Port
Shanghai
Accepted Delivery Terms
Employees
501-1000 people
Accepted Payment Currency
USD,EUR,JPY
Average Lead Time
90 Day(s)
Certifications
Chat NowRequest meeting
Product Details
Product SpecificationsProduct Description
Product Specifications
--
Product Description
Overview
Quick Details
Place of Origin:
Henan, China
Brand Name:
GUOXI
Model Number:
GX-03
Application:
Sputtering target
Weight:
125kg
Dimensions:
Customized
Grade:
Copper
Alloy Or Not:
Non-Alloy
Powder Or Not:
Not Powder
Cu Content (%):
99.99995%
Package:
Vacuum plastic bag
Color:
Reddish-orange
Atomic Weight:
63.55
Melting point:
1083.4±0.2 ℃
Boiling point:
2567 ℃
Packaging & Delivery
Packaging Details
Vacuum plastic bag for inner package and wooden case for outer package.
Port
Qingdao
Lead Time :
Quantity(Kilograms)1 - 1000 >1000
Est. Time(days)15To be negotiated

6N 99.99995% copper cathode plate for semiconductor packaging bonding wire from China supplier

Product Description

 

 

Item Name6N 99.99995% copper cathode plate for semiconductor packaging bonding wire
Purity99.9999%
AppearanceReddish Metal In Various Forms
Melting Point1085 °C
Boiling Point2562 °C
Density8.96 g/cm3
SizeCustomized
ApplicationElectronics
Medical Devices
Metallurgy
Scientific Research
Solar Energy
High-end Audio Cable

 

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       DELIVERY

            Samples and trial orders will be sent by express, bulk orders will be sent by air or                  by sea as your request.

 

 

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To: Peter Shen
Meo Machinery Co.LTD
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