Thermal Gel | ||||||
Sheen gel series | Thermal conductivity | Extrusion speed | Dielectric Breakdown Voltage | |||
1.0 W/mK | 35g/min | >5KV/AC/mm | ||||
2.0 W/mK | 30g/min | >5KV/AC/mm | ||||
3.0 W/mK | 25g/min | >5KV/AC/mm | ||||
3.5 W/mK | 25g/min | >5KV/AC/mm | ||||
4.0 W/mK | 20g/min | >5KV/AC/mm | ||||
5.0 W/mK | 15g/min | >5KV/AC/mm | ||||
6.0 W/mK | 12g/min | >5KV/AC/mm | ||||
2.5 W/mK | 35g/min | >5KV/AC/mm | ||||
3.0 W/mK | 30g/min | >5KV/AC/mm | ||||
4.0 W/mK | 25g/min | >5KV/AC/mm | ||||
5.0 W/mK | 25g/min | >5KV/AC/mm | ||||
8.0W/mK | 20g/min | >5KV/AC/mm |
Product performance | Test Results | Test Methods |
Colour | Pink | Visual |
Extrusion speed | ||
(30ccEFDcartridges1” | 12g/min | -- |
orifice 90psi) | ||
Specific gravity | 3.3g/cm3 | Helium true density method |
Viscosity(mPa.s) | 700000 | ASTM D2196 |
Volume resistance | >1013Ωcm | ASTM D257 |
Thermal Conductivity | 6.0W/mK | ASTM D5470 |
Dielectric breakdown strength | >200 VAC/mil | ASTM D149 |
Dielectric constant | 5.50 | ASTM D150 |
Minimum interface thickness | 0.09mm | -- |
Operating temperature | -50~200℃ | -- |
Storage time | 12month | -- |
Thermal expansion coefficient | 175ppm/K | ASTM E831 |
Flame retardancy | V-0 | UL 94 |
RoHS(10) | PASS | IEC 62321 |
Halogen(4) | PASS | EN14582 |
REACH(191) | PASS | EN14372 |
Tel | +86-769-22479425 | Address | 6th Floor, Building M, Jinxiongda Science and Technology Park, Datanglang Villiage, Dalingshan Town, Dongguan City, Guangdong Province, China |
Fax | +86-769-82784017 | ||
Web | http://sheen.en.alibaba.com/ http://www.usheenthermal.com/ | E-Mail Address | tina@u-sheen.com |