Protection function description
Overcharge protection: When the battery is under the charging state, the voltage keeps going up. When the protection board detects that the voltage of any cell is higher than the overcharge protection value, the protection board will start timing immediately. When the time reaches the overcharge protection delay, the protection board will turn off the charging MOS tube, at that time, it cannot be charged.
Overcharge protection recovery: After the overvoltage protection appears on the protection board, the battery voltage will going down under the static or discharge state of the battery. When the protection board detects that each voltage is lower than the recovery voltage of the overcharge protection, the protection board will output a signal and turn on the charging MOS tube to charge.
Over-discharge protection: When the battery is under the discharge state, the voltage keeps going down. When the protection board detects that the voltage of any cell is lower than the overcharge protection value, the protection board will start timing immediately. When the time reaches the over discharge protection delay, the output signal of the protection board will turn off the discharge MOS tube, the load lock circuit will work, but, it cannot discharge at this time.
Over discharge protection recovery: After the over discharge protection appears on the protection board, the battery voltage will going up under the static or discharge state of the battery. When the protection board detects that each voltage is higher than the recovery voltage of the over discharge protection. At this time, disconnect the load or charge, the protection board will output a signal and turn on the charging MOS tube to charge.
Overcurrent protection: When the battery is under the static or discharge state, the current suddenly increases. When the protection board detects that the current reaches the overcurrent protection value, the protection board will start timing at that time. When the current duration in the cir
NO. | ITEM | Manufacturer capacity |
1 |
Material | FR-4/Aluminum/CEM1/CEM3 |
2 | Layer | 1~24Layer |
3 | Min line width /distance | 5/5mil |
4 | Solder mask color | green/blue/black |
5 | Surface finish | ENIG/OSP/HASL/ENIG+OSP |
6 | Board thickness | 0.8mm-4.0mm |
7 | Laser drill hole diameter | 0.1mm |
8 | Mechanical hole diameter(Finished board) | 0.1-6.2mm |
9 | Silkscreen color | white/yellow/black |
10 | Molding method | Routing /V-CUT |
Mondo technology Co., Ltd was founded in 2009, located in Bao an district, Shenzhen, China. Just 15 mins near the Shenzhen airport. we are one of the leading manufacturers and exporters of FPC, PCBA, SMT assembly production and marketing.
Mengdi has 6,000 square meters factory area , independen oduction department . Our team includes more than 20 senior engineers and 300 experienced workers. After 9 years' operation and development, we have high-tech equipments and a experienced R&D team, a hard work and enterprising sales team and hundreds of experienced production assembling workers, as well as professional service.
Our products can be widely applied to a variety of fields, including communication, computers, medical equipments, consumer electronics and automobile industry.Our products past CE, ROSH, SAA,FCC,3C and more certifications.And own numbers of design patents. Plus, our factory has passed and strictly implemented the ISO9001:14001 international standard quality management system.
We focus on R&D, producing and promotion, we provide samples and mass production, rapid delivery and best services to customers worldwide. Currently, our products have been sold in USA, Germany,UK,France,Japan and other countries.
Our company's goal is to be one of leading FPC and SMT suppliers with prominent performance and technology in China.
We are professional manufacture, so we can offer below service:
PCB design
Reverse Engineering-PCB copy, PCB clone, IC decode
Quick prototyping
Components sourcing and purchasing
FPC making Mold making
and plastic injection
PCB, PCBA SMD, SMT assembly
Supply chain service
Testing
AOI Testing
Check for line width and spacing
Check for solder paste
Check for components down to 0201"
Check for missing components, off set, incorrect parts, polarity
X-RAY Testing
Check for the BGAS
Check for the Micro BGAS
Check for the chip scale packages
Check for the Bare board
IN-Circuit Testing
Power-up Test
Function Test
Flash device programming
Advantages