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100% Original Soldering Flux Paste BGA Solder Paste For Mobile Phone Motherboard Welding Repair Tools
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Meorient Import & Export Co.LTD
China - Hangzhou
Trading Company
Trade Capacity
Export Percentage
Nearest Port
Hangzhou,Shanghai
Accepted Delivery Terms
Employees
5-10人
Accepted Payment Currency
USD,CNY
Average Lead Time
45 Day(s)
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Product Specifications
--Product Description
Product Description
100% Original Soldering Flux Paste BGA Solder Paste For Mobile Phone Motherboard Welding Repair Tools
The 559 Flux Paste is a high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates.
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